Technical Reference
Laser techniques Patent portfolio Technical papers |
Patents
| US Patent |
Other Patent |
Title |
| Pending |
|
A system for probing a DUT comprising a tunable or CW laser source, and a modulator for modulating the output of the laser source. |
| Pending |
|
Contactless measurements of voltage characteristics of dynamic electrical signals in integrated circuits |
| Pending |
|
Hard-docking of a tester head to a DUT, while permitting the angular alignment of a specimen to be inspected to the optical axis of an optical testing tool |
| Pending |
|
Probe-less non-invasive detection of electrical signals from integrated circuit devices |
| Pending |
|
Image to image alignment using oversampled cross correlation |
| Pending |
|
Discrimination between photons emitted by transistors and photons emitted by background sources |
| 7,327,452 |
|
Light Beam Apparatus and Method for Orthogonal Alignment of Specimen |
| 7,323,862 |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
| 7,314,767 |
|
Method for Local Wafer Thinning and Reinforcement |
| 7,297,948 |
|
Column Simultaneously Focusing a Particle Beam and an Optical Beam |
| 7,257,507 |
|
System and Method for Determining Probing Locations on IC |
| 7,245,133 |
|
Integration of Photon Emission Microscope and Focus Ion Beam |
| 7,243,039 |
|
System and Method for Determining Probing Locations on IC |
| 7,230,240 |
|
Enhanced Scanning Control of Charged Particle Beam Systems |
| 7,228,464 |
|
PICA System Timing Measurement & Calibration |
| 7,227,702 |
|
Bi-Convex Solid Immersion Lens |
| 7,227,580 |
|
Knife Edge Tracking System and Method |
| 7,224,828 |
Taiwan I256097 |
Time Resolved Non-Invasive Diagnostics System |
| 7,115,426 |
|
Method and Apparatus for Addressing Thickness Variations of a Trench Floor Formed in a Semiconductor Substrate |
| 7,135,678 |
|
Charged Particle Guide |
| 7,135,123 |
|
Method and System for Integrated Circuit Backside Navigation |
| 7,123,035 |
|
Optics Landing System and Method Therefor |
| 7,113,630 |
|
PICA System Detector Calibration |
| 7,102,374 |
|
Spray Cooling Thermal Management System and Method for Semiconductor Probing, Diagnostics, and Failure Analysis |
| 7,060,196 |
|
FIB Milling of Copper over Organic Dielectrics |
| 7,049,593 |
France 2812455 |
Superconducting Single Photon Detector |
| 7,045,791 |
Germany 345871 France 2806527 Taiwan NI-203223 |
Column Simultaneously Focusing a Particle Beam and an Optical Beam |
| 7,042,647 |
|
Scanning Optical System |
| 7,042,563 |
|
Optical Coupling for Testing Integrated Circuits |
| 7,038,442 |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
| 7,036,109 |
|
Imaging Integrated Circuits with Focused Ion Beam |
| 7,012,537 |
|
Beacon Circuit for Photo Emission Voltage Analysis |
| 7,009,173 |
|
Lens Mount Integrated with a Thermoelectrically Cooled Photodetector Module |
| 6,985,219 |
|
Optical Coupling for Testing Integrated Circuits |
| 6,976,234 |
|
Apparatus & Method for Measuring Characteristics of Dynamic Electrical Signals in Integrated Circuits |
| 6,967,491 |
|
Spatial and Temporal Selective Laser Assisted Fault Localization |
| 6,961,672 |
|
Universal Diagnostic Platform for Specimen Analysis |
| 6,958,248 |
|
Method and Apparatus for the Improvement of Material/Voltage Contrast |
| 6,956,365 |
|
System and Method for Calibration of Testing Equipment using Device Photoemission |
| 6,955,930 |
|
Method and Apparatus for Determining Thickness of a Semiconductor Substrate at the Floor of a Trench |
| 6,943,572 |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
| 6,939,209 |
|
Method for Backside Die Thinning and Polishing of Packaged Integrated Circuits |
| 6,905,623 |
|
Precise, In-situ Endpoint Detection for Charged Particle Beam |
| 6,891,363 |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
| 6,872,581 |
|
Measuring Back-Side Voltage of an Integrated Circuit |
| 6,859,031 |
Korea 734186 Taiwan 1264791 |
Apparatus and Method for Dynamic Diagnostic Testing of Integrated Circuits |
| 6,855,622 |
|
Method and Apparatus for Forming a Trench Through a Semiconductor Substrate |
| 6,853,941 |
|
Open-Loop for Waveform Acquisition |
| 6,848,087 |
|
Sub-Resolution Alignment of Images |
| 6,836,131 |
Taiwan I 251067 |
Spray Cooling and Transparent Cooling Plate Thermal Management System |
| 6,828,811 |
|
Optics Landing System and Method Therefor |
| 6,825,978 |
Singapore 106891 Korea 433311 |
High Sensitivity Thermal Radiation Detection with an Emission Microscope with Room Temperature Optics |
| 6,824,655 |
|
Process for Charged Particle Beam Micro-Machining of Copper |
| 6,819,117 |
|
PICA System Timing Measurement & Calibration |
| 6,812,464 |
Taiwan 166651 |
Superconducting Single Photon Detector |
| 6,797,581 |
|
Avalanche Photo Diode for Photon Counting Applications and Method Thereof |
| 6,781,218 |
|
Method and Apparatus for Accessing Internal Nodes of an Integrated Circuit Using IC Package Substrate |
| 6,778,327 |
Taiwan I 249622 |
Bi-Convex Solid Immersion Lens |
| 6,744,267 |
Singapore 108393 |
Test System and Methodology |
| 6,737,853 |
|
Photoconductive-Sampling Voltage Measurement |
| 6,731,327 |
|
Dynamic Structural Coupling Mechanism for Reducing Optical Degradation in Vibrating Environments |
| 6,720,588 |
Taiwan 201324 |
Avalanche Photo Diode for Photon Counting Applications |
| 6,672,947 |
|
Method for Global Die Thinning and Polishing of Flip-Chip Packaged Integrated Circuits |
| 6,630,667 |
Taiwan 159509 |
Compact, High Collection Efficiency Scintillator for Secondary Electron Detection |
| 6,621,275 |
|
Time Resolved Non-Invasive Diagnostics System |
| 6,594,086 |
EPC 1466194 |
Bi-Convex Solid Immersion Lens |
| 6,518,571 |
|
Through the Substrate Investigation of Flip-Chip ICs |
| 6,501,288 |
Taiwan 197139 |
On-Chip Optically Triggered Latch for IC Time Measurements |
| 6,496,261 |
Taiwan 194194 |
Double-Pulsed Optical Interferometer for Waveform Probing of Integrated Circuits |
| 6,462,814 |
Taiwan 161277 |
Beam Delivery and Imaging for Optical Probing of a Device Operating under Electrical Test |
| 6,410,924 |
|
Energy Filtered Focused Ion Beam Column |
| 6,252,222 |
Taiwan 170491 |
Differential Pulsed Laser Beam Probing of Integrated Circuits |
| 6,225,626 |
|
Through the Substrate Investigation of Flip-Chip ICs |
| 6,081,110 |
Korea 0628445 |
Thermal Isolation Plate for Probe Card |
| 5,920,073 |
|
Optical System with an Axially Moveable Apertured Plate |
| 5,905,577 |
|
Dual-Laser Voltage Probing of ICs |
| 5,905,266 |
Taiwan NI-121589 |
Charged Particle Beam System with Optical Microscope |
| 5,840,630 |
Germany 69703611.1 Korea 10-510431 Taiwan NI-109360 |
FIB Etching Enhanced with 1,2 Di-Iodo-Ethane |
| 5,821,549 |
|
Through the Substrate Investigation of Flip-Chip ICs |
| 5,747,818 |
France 0838836 Germany 69724549.7 |
Thermoelectric Cooling Gas-Assisted FIB System |
| 5,731,984 |
|
Vector-Based Waveform Acquisition and Display |
| 5,700,526 |
|
Insulator Deposition Using Focused Ion Beam |
| 5,698,474 |
|
High Speed Diamond-Based Machining of Silicon Semiconductor Die in Wafer and Packaged Form for a Backside Emission Microscope Detection |
| 5,675,499 |
|
Method of Probing a Net of an IC at an Optimal Probe-Point |
| 5,638,005 |
|
Predictive Waveform Acquisition |
| 5,616,921 |
|
Self-Masking FIB Milling |
| 5,604,819 |
|
Determining Offset between Images of an IC |
| 5,530,372 |
|
Method of Probing a Net of an IC at an Optimal Probe-Point |
| 5,475,316 |
|
Transportable Image Emission Microscope |
| 5,401,972 |
|
Layout Overlay for FIB Operations (Includes electronic beam deflection) |
| |
Japan 3633993 |
Optimal Probe Point Placement |
| 5,392,222 |
|
Locating a Field of View in which Selected IC Conductors are Unobscured |
| 5,357,116 |
|
Focused ION Beam Processing with Charge Control |
| 5,210,487 |
|
Double-Gated Integrating Scheme for Electron Beam Tester |
| 5,282,088 |
|
Aplanatic Microlens and Method for Making Same |
| 5,270,643 |
|
Pulsed Laser Photoemission Electron-Beam Probe |
| 5,144,225 |
|
Methods and Apparatus for Acquiring Data from Intermittently Failing Circuits |
| 5,127,064 |
|
High Resolution Image Compression Methods and Apparatus |
| 5,054,097 |
|
Methods and Apparatus for Alignment of Images |
| 4,912,405 |
|
Magnetic Lens and Electron Beam Deflection System |
|
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