State-of-the-art photon detection technology allows the EmiScope to measure logical switching activity and timing information with sub-picosecond accuracy from virtually any active transistor in both flip-chip and wirebond devices. The innovative time-resolved photon emission detection technology enables semiconductor manufacturers to perform debug and characterization more quickly and effectively, thus bringing products to market faster, with fewer design respins.

Debug of flip-chip packaged and multi-metal layer devices. Built on the hardware and software foundation of the award-winning EmiScope-II, the EmiScope-IIIt adds configuration flexibility while maintaining ease-of-use.

The EmiScope's high bandwidth and short acquisition times allow engineers to collect as much-or as little-information as they need to solve problems quickly. The system's high-bandwidth electronics, high-resolution imaging, and data management capabilities enable semiconductor manufacturers to perform timely design debug, failure analysis, and characterization.

The patented solid immersion lens (SIL) option delivers three times the resolution of traditional air-coupled lenses, allowing more precise device navigation and improved signal waveform measurements. The SIL provides five times the signal acquisition rate compared to traditional lens, enabling fast measurements of sub-1.0 volt devices.

A "long-working distance" SIL (LWD-SIL) brings solid-immersion lens resolution and performance to devices in wirebond packaging and board-level applications.

Patented Spray Cooling technology is available for probing high-power devices. This unique method of heat dissipation is available on EmiScope and Ruby.

Both wirebond and flipchip devices can be probed using a variety of user-swappable lens sets-including five lens sets for a variety of package types. The EmiScope-IIIt is upgradeable with Laser Scanning Microscope (LSM) technology. Designers and failure analysis engineers can trace through circuits inside actual silicon.