Technical Papers and Presentations - 2009
IPFA 2009 (Suzhou, China)
EFUG 2009
- "Design for Edit," T. Lundquist (Poster)
ESREF 2009
DCG/Spirox Technical Seminar - Taiwan
- "The Role of Spirox in FA Challenges & Solutions," CJ Hsieh (Spirox EVSD)
- "DFP: The Future of FA," Colin Bolger (Spirox EVSD)
- "Design-for-Test Enabled Dynamic Emission for Failure Analysis and Yield Enhancement," Steven Kasapi, (NVIDIA)
- Smart Alternative Solution for IC and System Level ESD Issues, " Yoon-Jong Huh, API/GTL
- "FIB Modification of Advanced Si Devices for 45nm and Beyond," Dane Scott (Intel)
- "FA Solutions for Advanced Process Technologies," Israel Niv (DCG)
DCG Technical Seminar 2009 - Japan
- "FIB Modification of Advanced Si Devices for 45nm and Beyond," Dane Scott (Intel)
- "Design-for-Test Enabled Dynamic Emission for Yield Enhancement," Steven Kasapi (NVIDIA)
- "Current Yield Analysis Processes and Challenges," Takashi Setoya (Toshiba)
- "FA Workflow at Toshiba, Ohita Fab," Takashi Setoya (Toshiba)
- "Failure Analysis Workflow using DCG Tools," Akira Shimase (Renesas)
- "Reverse Engineering Techniques," Shigeru Nakajima (VAN Partners Corporation)
LSI Test Symposium (LSIT) 2009 - Japan
- "Meridian-IV laser voltage imaging and probing options," S. Motegi, et al.
- "A Next generation circuit edit system," S. Motegi, et al.
- "Contact to diffusions for advanced backside circuit edit," H. Tanaka, et al.
- "Characterization of transistor by use of backside FIB circuit edit, K. Goshima, et al. (with Sanyo)
DCG Technical Seminar 2009 - North America
ISTFA 2009
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