Technical Papers and Presentations - 2009

IPFA 2009 (Suzhou, China)

• "Full Dynamic Laser Stimulation Set Up and First Results"
  A. Deyine, et al. (with THALES & CNES) (purchase online)
• "RF Performance Increase allowing IC Timing Adjustments by use of Backside FIB Processing”
  R. Schlangen, et al. (with Berlin University of Technology) (purchase online)
• “Enhanced wafer analysis using a combination of test, emission and software net tracing”
  R. Portune, et al. (with Atmel). (purchase online)

EFUG 2009

• "Design for Edit,"
  T. Lundquist (Poster)

ESREF 2009

• "Jitter Analysis of PLL-Generated Clock Propagation using Jitter Mitigation Techniques with Laser Voltage Probing,"
  J. Liao, et al. (with NVIDIA)
• "Physical Analysis, Trimming and Editing of Nanoscale IC Function with Backside FIB Processing,"
  R. Schlangen, et al. (with Berlin University of Technology) (purchase online)

DCG/Spirox Technical Seminar - Taiwan

• "The Role of Spirox in FA Challenges & Solutions,"
  CJ Hsieh (Spirox EVSD)
• "DFP: The Future of FA,"
  Colin Bolger (Spirox EVSD)
• "Design-for-Test Enabled Dynamic Emission for Failure Analysis and Yield Enhancement,"
  Steven Kasapi, (NVIDIA)
• Smart Alternative Solution for IC and System Level ESD Issues, "
  Yoon-Jong Huh, API/GTL
• "FIB Modification of Advanced Si Devices for 45nm and Beyond,"
  Dane Scott (Intel)
• "FA Solutions for Advanced Process Technologies,"
  Israel Niv (DCG)

DCG Technical Seminar 2009 - Japan

• "FIB Modification of Advanced Si Devices for 45nm and Beyond,"
  Dane Scott (Intel)
• "Design-for-Test Enabled Dynamic Emission for Yield Enhancement,"
  Steven Kasapi (NVIDIA)
• "Current Yield Analysis Processes and Challenges,"
  Takashi Setoya (Toshiba)
• "FA Workflow at Toshiba, Ohita Fab,"
  Takashi Setoya (Toshiba)
• "Failure Analysis Workflow using DCG Tools,"
  Akira Shimase (Renesas)
• "Reverse Engineering Techniques,"
  Shigeru Nakajima (VAN Partners Corporation)

LSI Test Symposium (LSIT) 2009 - Japan

• "Meridian-IV laser voltage imaging and probing options,"
  S. Motegi, et al.
• "A Next generation circuit edit system,"
  S. Motegi, et al.
• "Contact to diffusions for advanced backside circuit edit,"
  H. Tanaka, et al.
• "Characterization of transistor by use of backside FIB circuit edit,"
  K. Goshima, et al. (with Sanyo)

DCG Technical Seminar 2009 - North America

• "Defect localization on IC level and at fully packaged devices using Lock-in Thermography,"
  Christian Schmidt ( Fraunhofer Institute for Material Mechanics of Materials) (download)
• "Advanced Optical Probing for the 22nm node and beyond,"
  Keith A. Serrels (Heriot Watt University School of Engineering and Physical Sciences) (download)
• "Increasing the Local Operating IC Speed with Backside FIB processes,"
  Rudolf Schlangen, (Berlin University of Technology) (download)
• "Application of Laser Stimulation Techniques to Analog ICs Debug,"
  Magdalena Sienkiewicz (Freescale, France),
• “Flexible optical components by Backside FIB processes for high resolution IC debug techniques,"
  Philipp Scholz (Berlin University of Technology) (download)
• "Laser Modulation Techniques & Applications,"
  Dmitry Skvortsov (DCG)

ISTFA 2009

• "A Versatile Design of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Techniques,"
  Philipp Scholz et al. (with Berlin University of Technology, DCG) (download)
• "Global Die UltraThin Silicon for Backside Diagnostics and Circuit Edit,"
  (with Intel)
• "Case Study: Failure analysis of functional shmoo hole with Laser Voltage Probing,"
  (Poster, with Samsung) (download)
• "From Static to Full Dynamic Laser Stimulation,"
  (with CNES) (download)
• "Laser Voltage Imaging,"
  (Poster presentation) (download)