Technical Papers and Presentations - 2009
IPFA 2009 (Suzhou, China)
EFUG 2009
- "Design for Edit,"
T. Lundquist (Poster)
ESREF 2009
DCG/Spirox Technical Seminar - Taiwan
- "The Role of Spirox in FA Challenges & Solutions,"
CJ Hsieh (Spirox EVSD)
- "DFP: The Future of FA,"
Colin Bolger (Spirox EVSD)
- "Design-for-Test Enabled Dynamic Emission for Failure Analysis and Yield Enhancement,"
Steven Kasapi, (NVIDIA)
- Smart Alternative Solution for IC and System Level ESD Issues, "
Yoon-Jong Huh, API/GTL
- "FIB Modification of Advanced Si Devices for 45nm and Beyond,"
Dane Scott (Intel)
- "FA Solutions for Advanced Process Technologies,"
Israel Niv (DCG)
DCG Technical Seminar 2009 - Japan
- "FIB Modification of Advanced Si Devices for 45nm and Beyond,"
Dane Scott (Intel)
- "Design-for-Test Enabled Dynamic Emission for Yield Enhancement,"
Steven Kasapi (NVIDIA)
- "Current Yield Analysis Processes and Challenges,"
Takashi Setoya (Toshiba)
- "FA Workflow at Toshiba, Ohita Fab,"
Takashi Setoya (Toshiba)
- "Failure Analysis Workflow using DCG Tools,"
Akira Shimase (Renesas)
- "Reverse Engineering Techniques,"
Shigeru Nakajima (VAN Partners Corporation)
LSI Test Symposium (LSIT) 2009 - Japan
- "Meridian-IV laser voltage imaging and probing options,"
S. Motegi, et al.
- "A Next generation circuit edit system,"
S. Motegi, et al.
- "Contact to diffusions for advanced backside circuit edit,"
H. Tanaka, et al.
- "Characterization of transistor by use of backside FIB circuit edit,"
K. Goshima, et al. (with Sanyo)
DCG Technical Seminar 2009 - North America
ISTFA 2009
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